3,802 technical terms and definitions
in situ ellipsometry, real-time spectroscopic ellipsometry, real time ellipsometry, in-situ process monitoring, ellipsometry endpoint detection, in-situ thin film metrology
In-situ ellipsometry watches a surface while deposition, etching, annealing, adsorption, oxidation, or another process is still occurring. That timing changes the measurement…
in situ tem, in-situ transmission electron microscopy, operando tem, tem heating biasing, in-situ tem semiconductor
In semiconductor process development, a cross-sectional TEM image can show where an interface ended up, but it cannot by itself reveal which event created that interface. In-situ…
incoming bare wafer substrate defect inspection prediction machine learning, incoming bare, wafer substrate defect, incoming bare wafer, bare wafer substrate
Incoming Bare Wafer Substrate Defect Inspection Prediction with Machine Learning Introduction & Motivation Incoming Bare Wafer Substrate Defect Inspection Prediction with Machine…
incoming wafer material qualification prediction, incoming wafer material, wafer material qualification, material qualification prediction, incoming wafer
Incoming Wafer Material Qualification Prediction with Machine Learning Introduction & Motivation Incoming Wafer Material Qualification Prediction with Machine Learning addresses…
packaging
Incomplete filling is the molding defect where encapsulant does not fully occupy all intended cavity regions around the package - it can create exposed structures, weak protection…
india semiconductor mission, what is india semiconductor mission
A national institution for semiconductor ecosystem development. India Semiconductor Mission, or ISM, is the coordinating institution established to support India’s semiconductor…
indium phosphide epiwafer defect prediction, indium phosphide epiwafer, phosphide epiwafer defect, epiwafer defect prediction, indium phosphide, phosphide epiwafer, epiwafer defect
Indium Phosphide Epiwafer Defect Prediction with Machine Learning Introduction & Motivation Indium Phosphide Epiwafer Defect Prediction with Machine Learning addresses a central…
semiconductor industry carbon neutrality goal, semiconductor industry carbon, industry carbon neutrality, carbon neutrality goal, semiconductor industry, industry carbon, neutrality goal
Semiconductor Industry Carbon Neutrality Goal Introduction & Motivation Semiconductor Industry Carbon Neutrality Goal addresses a central problem in sustainability process control…
semiconductor industry carbon neutrality goals, semiconductor industry carbon, industry carbon neutrality, carbon neutrality goals, semiconductor industry, industry carbon, carbon neutrality
Semiconductor Industry Carbon Neutrality Goals Introduction & Motivation Semiconductor Industry Carbon Neutrality Goals addresses a central problem in sustainability process…
inference chip, what is inference chip
An inference chip is a chip whose job is to run an already-trained model as fast, as cheaply, or as energy-efficiently as possible — producing predictions or generating tokens…
info, integrated fan-out, advanced packaging
Integrated Fan-Out is TSMC's fan-out wafer-level packaging technology that redistributes die I/O to a larger area without a traditional package substrate. First used in Apple's…
lithography
Infrared alignment is the alignment technique that uses infrared transmission through silicon to view frontside marks from the backside during lithography registration - it is…
IR ellipsometry, infrared spectroscopic ellipsometry, IR-VASE, FTIR ellipsometry, far-infrared ellipsometry, infrared dielectric function metrology
Infrared ellipsometry extends polarization-resolved optical metrology into energies where lattice vibrations, molecular bonds, free carriers, and low-energy excitations dominate…
semiconductor infrastructure, datacenter infrastructure, power delivery, pue, cooling, liquid cooling, fab facility, ultrapure water, rack power, thermal resistance, vrm, co-packaged optics, grid interconnection
Infrastructure is everything a chip depends on that is not the chip: the power chain that delivers current to it, the thermal chain that carries heat away, the water and air that…
silicon ingot, boule, crystal ingot, ingot grinding, wafer flat, wafer notch, ingot yield, four-point probe resistivity
An ingot is the solid block of material, cast or grown, that is cut into smaller pieces; in semiconductor work it is the cylinder of silicon or germanium that comes out of…
packaging, thermoplastic encapsulation, gate placement, cooling channel design, warpage, sink marks, mold tooling cost, SPC process control, package housing
Injection molding forms shaped electronics components by plasticizing a thermoplastic material and injecting it at high pressure into a mold cavity, where it cools and solidifies…
metrology
Spectroscopic ellipsometry and inline optical wafer metrology constitute the non-destructive physical measurement and defect detection disciplines that govern yield control across…
wafer inspection control, defect classification review, yield learning methodology, automated defect detection
In-Line Defect Monitoring and Control — In-line defect monitoring systematically inspects wafers at critical process steps throughout the CMOS fabrication flow to detect…
inline process control, inline cd measurement, inline overlay, inline thickness measurement, process control semiconductor
Spectroscopic ellipsometry and inline optical wafer metrology constitute the non-destructive physical measurement and defect detection disciplines that govern yield control across…
yield enhancement
Spectroscopic ellipsometry and inline optical wafer metrology constitute the non-destructive physical measurement and defect detection disciplines that govern yield control across…
nanosheet finfet, inner spacer formation, inner spacer dielectric deposition, selective etch inner spacer, inner spacer capacitance, gaa, nanosheet
Gate-All-Around (GAA) nanosheet field-effect transistors, Multi-Bridge Channel FETs (MBCFET), and vertically stacked ribbon architectures constitute the advanced three-dimensional…
inner spacer gaa, spacer dielectric deposition, inner spacer etch selectivity, spacer parasitic capacitance
Inner Spacer Formation in Gate-All-Around (GAA) & CFET Architectures In Gate-All-Around (GAA) nanosheet field-effect transistors and complementary FETs (CFET), inner spacer…
compound semiconductor hbt, inp mosfet high frequency, indium phosphide semiconductor, iii-v compound semiconductor
An InP/InGaAs heterostructure deliberately places material discontinuities to control carriers. In an InAlAs/InGaAs HEMT, barrier-supplied electrons accumulate in a lower-energy…
inp photonic wafer test yield prediction machine learning, inp photonic, wafer test yield, inp photonic wafer test yield prediction, inp photonic wafer, photonic wafer test
InP Photonic Wafer Test Yield Prediction with Machine Learning Introduction & Motivation InP Photonic Wafer Test Yield Prediction with Machine Learning addresses a central problem…
Metrology and inspection are the two measurement disciplines that keep a semiconductor fab in control — they are how a foundry knows, wafer by wafer, whether hundreds of process…
equipment installation qualification, semiconductor equipment qualification, tool installation qualification, installation qualification protocol
Installation qualification (IQ) is the documented demonstration that semiconductor manufacturing equipment, its facilities hookups, safety provisions, software baseline…
IC, microchip, silicon chip, Jack Kilby, Robert Noyce, planar process, Moore's law
An integrated circuit is a complete electronic circuit, with its transistors, resistors, capacitors and the wiring between them, fabricated together on a single small piece…
idpc, idpc-stem, integrated dpc, integrated differential phase contrast stem, light element stem imaging, idpc semiconductor interface
High-angle annular dark-field STEM makes heavy atomic columns easy to recognize because strong high-angle scattering creates intuitive bright contrast, but that same weighting can…
metrology
Integrated metrology places measurement capability inside a process chamber, on a cluster-tool platform, or immediately adjacent to the production module so results are available…
first DRAM, 1-kilobit DRAM, magnetic core memory replacement, dynamic RAM, semiconductor memory
The Intel 1103 was the first commercially successful dynamic random-access memory chip, introduced by Intel in 1970, a 1-kilobit DRAM that is widely credited with displacing…
486 processor, on-chip cache, integrated FPU, pipelined x86, microarchitecture
The Intel 80486, introduced in 1989, was a 32-bit x86 processor that advanced the line mainly through integration and performance refinements rather than a new architecture…
network on chip topology, fat tree interconnect, torus mesh topology, dragonfly topology hpc
Interconnect Topology Design — Interconnect topology defines the physical and logical arrangement of communication links between processors, memory, and I/O devices in parallel…
metrology
Interference in analytical metrology is any signal or effect that causes the measurement result to differ from the true value of the analyte — encompassing spectral overlaps…
safety interlock, equipment interlock, semiconductor equipment interlock, process safety interlock
An interlock is an engineered control that prevents a semiconductor manufacturing tool from entering or remaining in a hazardous state unless defined safety conditions are…
packaging
Intermetallic formation is the metallurgical reaction at bonding interfaces where wire and pad metals form compound layers during and after bonding - controlled intermetallic…
itrs, business
The International Technology Roadmap for Semiconductors (ITRS) was the authoritative, globally synchronized industrial master plan that single-handedly orchestrated and sustained…
silicon interposer, packaging interposer, cowos, 2.5d packaging, business and strategy
Interposers are the substrates that carry 2.5D integration: a die-to-die wiring layer dense enough to route thousands of connections between chiplets that sit side by side.…
bandgap temperature dependence varshni passler, effective density of states temperature scaling, lattice expansion electron phonon coupling, dark saturation current reliability, wide-bandgap semiconductors sic gan
Intrinsic Carrier Concentration and Temperature Kinetics of Energy Bandgaps: From Quantum Theory to Device Engineering Executive Summary The intrinsic carrier concentration…
inverse lithography technology convergence prediction, inverse lithography technology, lithography technology convergence, technology convergence prediction
Inverse Lithography Technology Convergence Prediction with Machine Learning Introduction & Motivation Inverse Lithography Technology Convergence Prediction with Machine Learning…
inverse lithography technology, ilt, lithography
Inverse Lithography Technology (ILT) is a computational lithography approach that treats mask design as a mathematical inverse problem — given the desired wafer pattern (target)…
ipes, metrology
Inverse photoemission spectroscopy (IPES) probes unoccupied electronic states by injecting electrons into a sample and detecting photons emitted when those electrons decay…
inverse problem, ill-posed problems, regularization, parameter estimation, OPC, scatterometry, virtual metrology
Inverse Problems 1. Introduction to Inverse Problems 1.1 Mathematical Definition In mathematical terms, a forward problem is defined as: where: = input parameters (process…
ion channeling metrology, crystal channeling, rbs channeling, channeling minimum yield, implant damage analysis, impurity lattice location
A silicon wafer can look chemically correct in a random Rutherford backscattering spectrum while still containing implantation disorder, epitaxial defects, or dopants displaced…
metrology
Spectroscopic ellipsometry and inline optical wafer metrology constitute the non-destructive physical measurement and defect detection disciplines that govern yield control across…
dopant, channeling, annealing, amorphization, junction depth, semiconductor doping, beamline implanter, doping
Ion implantation, atomic doping profile engineering, and advanced millisecond thermal annealing constitute the fundamental semiconductor manufacturing disciplines required…
Active Learning for Ion Implantation Active Learning for Ion Implantation Introduction Active Learning for Ion Implantation is an engineering workflow for precision dopant…
Anomaly Detection for Ion Implantation Anomaly Detection for Ion Implantation Introduction Anomaly Detection for Ion Implantation is an engineering workflow for precision dopant…
Bayesian Parameter Estimation for Ion Implantation Bayesian Parameter Estimation for Ion Implantation Introduction Bayesian Parameter Estimation for Ion Implantation is…
Causal Process Modeling for Ion Implantation Causal Process Modeling for Ion Implantation Introduction Causal Process Modeling for Ion Implantation is an engineering workflow…
Chamber Matching for Ion Implantation Chamber Matching for Ion Implantation Introduction Chamber Matching for Ion Implantation is an engineering workflow for precision dopant…