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Glossary

12 technical terms and definitions

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k dielectric anneal high

high-k anneal, post deposition anneal, hkmg thermal treatment, eot stabilization, hkmg

High-k metal gate (HKMG) integration, replacement metal gate (RMG / gate-last) processing, and dual work function metal (WFM) engineering constitute the foundational materials…

k means clustering wafer map pattern prediction machine learning

k-means clustering wafer map pattern prediction, k-means clustering wafer, clustering wafer map, wafer map pattern, map pattern prediction, k-means clustering, wafer map

K-Means Clustering Wafer Map Pattern Prediction with Machine Learning Introduction & Motivation K-Means Clustering Wafer Map Pattern Prediction with Machine Learning addresses…

k1 factor

rayleigh equation, resolution enhancement, process difficulty, lithography k1, multi-patterning

The k1 factor is the single number in the Rayleigh resolution equation that measures how hard a lithography process is being pushed relative to the physical limit of its own…

kelvin contact

metrology

Kelvin Contact (Four-Terminal Sensing) is the precision resistance measurement technique that eliminates probe contact resistance and lead resistance errors by using separate…

kelvin probe

metrology

A Kelvin probe measures contact potential difference (CPD)—the electrostatic potential between a vibrating probe tip and a sample surface—via an AC capacitive coupling…

kelvin probe force microscopy (kpfm)

kelvin probe force microscopy, kpfm, metrology

Kelvin Probe Force Microscopy (KPFM) is a scanning probe technique that measures the local contact potential difference (CPD) between a conductive AFM tip and a sample surface…

kerf loss

wafer dicing, scribe street width, blade dicing, laser dicing, plasma dicing, die per wafer, singulation

Kerf loss is the silicon area destroyed, not just divided, when a wafer gets cut into individual die — the width of material the saw blade, laser, or plasma stream actually…

killer defect size

metrology

Killer defect size is the minimum defect dimension that causes device failure — a critical threshold that determines inspection sensitivity requirements, with smaller nodes…

known good die for chiplets

kgd, advanced packaging

Known Good Die (KGD) is a semiconductor die that has been fully tested and verified to be functional before being assembled into a multi-die package — ensuring that only working…

koh etch

anisotropic silicon etching, wet etch silicon, potassium hydroxide etch, mems bulk micromachining, crystal plane etch, koh silicon etch, crystallographic etch, v groove etch

KOH etching is crystal-programmed silicon machining: hydroxide chemistry supplies removal, but wafer orientation, mask azimuth, plane-rate ratios, corner evolution…

krf (krypton fluoride)

krf, krypton fluoride, lithography

KrF (krypton fluoride) excimer lasers produce 248nm deep-UV light, and were the industry's workhorse exposure source from roughly 1996 to 2005 — carrying the transition…

krf-lithography

krf lithography, what is krf lithography

KrF lithography uses krypton-fluoride excimer-laser light to expose photoresist. Its nominal wavelength is 248 nanometers, within deep ultraviolet. The laser is part of a larger…