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Glossary

455 technical terms and definitions

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wide i/o

advanced packaging

Wide I/O is an early 3D-stacked DRAM standard designed for mobile applications that placed memory directly on top of the logic processor — using a 512-bit wide interface with TSV…

william shockley

shockley, shockley semiconductor laboratory, traitorous eight, junction transistor theory, mountain view, shockley eugenics

William Shockley (1910-1989) was an American physicist who shared the 1956 Nobel Prize in Physics for the transistor, wrote the theory of the junction transistor, and founded…

wire

bond, packaging, bondwire, interconnect, ultrasonic, thermocompression, pull, strength

Advanced packaging is the set of technologies that connect, protect and cool silicon after it leaves the fab. It has moved from a cost-driven back-end afterthought to a primary…

wire bonding

advanced packaging

Advanced packaging is the set of technologies that connect, protect and cool silicon after it leaves the fab. It has moved from a cost-driven back-end afterthought to a primary…

wire bonding

wire bond, ball bonding, wedge bonding, semiconductor packaging

Wire bonding is a semiconductor-packaging process that connects pads on a die to leads or substrate traces with fine metal wires. A capillary or wedge tool presses the wire…

wire bonding

die attach, semiconductor packaging assembly, gold wire bond, wedge bonding

Wire Bonding and Die Attach are the fundamental semiconductor packaging assembly processes that mount the die onto a substrate and create electrical connections between die pads…

wire bonding

wire bond, ball bonding, wedge bonding, semiconductor packaging

Wire bonding is a semiconductor-packaging process that connects pads on a die to leads or substrate traces with fine metal wires. A capillary or wedge tool presses the wire…

wire sweep

packaging

Wire sweep is the deformation or displacement of bonded wires caused by mold-flow forces during encapsulation - excessive sweep can create shorts and reliability failures. What Is…

wire sweep during molding

packaging

Wire sweep during molding is the displacement of bonded wires caused by molding-compound flow forces during encapsulation - it is a major reliability risk in wire-bond packages…

wirebond failure

ball lift, heel crack, wire sweep, bond reliability, failure analysis, packaging, wire bond

Wire bond failure modes are the mechanisms by which wire interconnections in IC packages degrade and fail — including ball lift, heel crack, wire sweep, and corrosion, each…

wireless chip

wifi chip, wi-fi chip, bluetooth chip, ble chip, wifi 7, wireless combo ic, radio baseband mac

Wireless chip integrates radio transceivers, data converters, baseband DSP, protocol MAC and host interfaces for standards such as Wi-Fi, Bluetooth/BLE and sometimes Zigbee…