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Glossary

128 technical terms and definitions

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glass interposer

advanced packaging, dielectric loss, crosstalk, through glass via, thermal expansion mismatch

Glass Interposer Packaging Electrical Advantage An interposer sits between a chip and the package substrate, routing dense interconnects that connect multiple dies together…

glass substrate packaging

glass interposer, glass core substrate, TGV glass packaging

Glass Substrate Packaging is the use of ultra-thin glass panels as the core interposer or packaging substrate material instead of conventional organic laminates or silicon…

global flatness

metrology

Spectroscopic ellipsometry and inline optical wafer metrology constitute the non-destructive physical measurement and defect detection disciplines that govern yield control across…

golden wafer

metrology

A golden wafer is a reference wafer with precisely known and stable properties used to calibrate metrology tools, verify equipment performance, and ensure measurement consistency.…

golden wafer baseline drift prediction with machine learning

golden wafer baseline drift prediction machine learning, golden wafer, baseline drift prediction, golden wafer baseline drift prediction, golden wafer baseline, wafer baseline

Golden Wafer Baseline Drift Prediction with Machine Learning Introduction & Motivation Golden Wafer Baseline Drift Prediction with Machine Learning addresses a central problem…

good die in a bad neighborhood

GDBN, wafer sort, spatial yield, neighbor die failure, wafer map binning, automotive reliability screening, AEC-Q100

Good die in a bad neighborhood (GDBN) is a wafer-sort screening rule that bins out a die that electrically passed its own test if too many of the dies immediately around it…

gpu nvlink interconnect

nvswitch all to all, nvlink 4.0 bandwidth, nvlink c2c chip to chip, nvidia dgx h100 nvlink

NVLink and NVSwitch GPU Interconnects: High-Bandwidth All-to-All GPU Networking — specialized interconnect technology enabling 900 GB/s per-GPU communication for tightly-coupled…

gpu vs cpu

difference between gpu and cpu, gpu vs cpu chip, what is the difference between a cpu and gpu, cpu vs gpu explained, why gpu for ai

A CPU and a GPU are both chips built by the same lithography and fabrication process, but they are laid out around opposite bets on what kind of work matters most: a CPU devotes…

granite surface plate

metrology

Granite surface plate is a precision-ground natural stone slab providing an extremely flat reference surface for dimensional measurements — the fundamental metrology reference…

graph theory

discrete mathematics graphs, vertices and edges, graph traversal, graph connectivity, shortest path algorithms, graph coloring, network flow, graph theory semiconductor

Graph theory studies systems by separating the things that exist from the relationships that connect them. A graph can represent nets joined by components, process steps…

graphene transistor fabrication

graphene bandgap engineering, graphene contact resistance, graphene high frequency, graphene rf applications

Graphene Transistor Fabrication: Dirac Physics, Bandgap Engineering & High-Frequency RF Devices When isolated as a free-standing monolayer, graphene—a two-dimensional honeycomb…

grating coupler

edge coupler, silicon photonics, fiber coupling, diffraction, wavelength sensitivity, packaging

Grating Coupler vs. Edge Coupler: Fiber-to-Chip Interface Light traveling inside a silicon photonics waveguide eventually has to transfer into or out of an optical fiber, and…

grazing incidence saxs

gisaxs, grazing-incidence small-angle x-ray scattering, grazing incidence small angle x-ray scattering, gisaxs thin film, gisaxs metrology

Grazing-incidence small-angle X-ray scattering turns weak nanoscale density variations at a surface or within a thin film into a two-dimensional reciprocal-space pattern.…

greek cross

metrology

Greek cross is a sheet resistance measurement pattern — a symmetric four-point probe structure shaped like a plus sign (+), providing more accurate sheet resistance measurements…

groq

cerebras, custom chip

Custom AI Accelerator Chips AI Chip Landscape Company Chip Focus NVIDIA H100, B200 General AI Groq LPU Low-latency inference Cerebras WSE-3 Largest chip, training Google TPU v5…

gross die per wafer forecast prediction machine learning

gross die per wafer forecast prediction, gross die per, die per wafer, per wafer forecast, wafer forecast prediction, gross die, die per, per wafer, wafer forecast, forecast prediction

Gross Die Per Wafer Forecast Prediction with Machine Learning Introduction & Motivation Gross Die Per Wafer Forecast Prediction with Machine Learning addresses a central problem…

gull-wing leads

packaging

Gull-wing leads is the outward and downward bent lead form used in many surface-mount packages to create visible solder joints - they offer good inspectability and compliance…