3D
gaussian, splatting, point, rendering
3D Gaussian Splatting is a novel 3D scene representation and rendering technique using a set of anisotropic Gaussian primitives with learnable properties — enabling real-time…
28,959 technical terms and definitions
gaussian, splatting, point, rendering
3D Gaussian Splatting is a novel 3D scene representation and rendering technique using a set of anisotropic Gaussian primitives with learnable properties — enabling real-time…
object, detection, LiDAR, deep, learning, point, cloud, voxel
3D Object Detection LiDAR Deep Learning is algorithms detecting and localizing 3D objects in point cloud data from LiDAR sensors, enabling autonomous driving and robotic…
3d, metrology
3D AFM is an advanced atomic force microscopy technique that measures the three-dimensional profile of high-aspect-ratio semiconductor structures — going beyond conventional…
3d vision
3D-aware generation is the generative modeling approach that incorporates explicit or implicit 3D scene structure for viewpoint-consistent image synthesis - it enables camera…
3d chip stacking and integration, 3d chip stacking, chip stacking integration, 3d chip, chip stacking, stacking integration
3D Chip Stacking and Integration Introduction & Motivation 3D Chip Stacking and Integration addresses a central problem in chip-architecture process control…
3d, video understanding
3D CNNs for video are the spatiotemporal convolutional networks that extend 2D kernels with a time dimension to learn motion and appearance jointly - they process short clips as…
3d convolutional, convolutional networks, 2d 3d cnn ct hmdb51 mri
3D Convolutional Networks Introduction & Motivation 3D CNNs: process volumetric and video data. Spatiotemporal convolution. Applications: video understanding, medical imaging…
3d detection point cloud prediction, 3d detection point, detection point cloud, point cloud prediction, 3d detection, detection point, point cloud, cloud prediction
3D Detection Point Cloud Prediction with Machine Learning Introduction & Motivation 3D Detection Point Cloud Prediction with Machine Learning addresses a central problem in 3D…
3d, signal & power integrity
3D Field Solver is full three-dimensional electromagnetic solver for high-fidelity interconnect and package analysis - It captures complex geometry effects that simplified…
3d, multimodal ai
3D Gaussian is a single Gaussian primitive in 3D space used to model local radiance and geometry contributions - It is the atomic unit in Gaussian-based neural scene…
3d, 3d vision
3D Gaussian primitives is the parametric scene elements defined by center, covariance, opacity, and color used in Gaussian splatting renderers - they are the fundamental building…
computer vision
3D Gaussian Splatting is a novel 3D scene representation using anisotropic 3D Gaussians — representing scenes as collections of oriented ellipsoids that can be rendered extremely…
structure from motion, multi view stereo, nerf, 3d gaussian splatting, photogrammetry
3D reconstruction estimates scene geometry, appearance, and camera relationships from images or range measurements. It creates digital twins, AR/VR assets, maps, cultural-heritage…
nerf, gaussian
AI 3D Generation is the field of deep learning that synthesizes three-dimensional objects, scenes, and environments from text prompts, single images, or sparse inputs — enabling…
nerf radiance field, gaussian splatting, 3d reconstruction deep learning, novel view synthesis
Neural 3D Generation and Reconstruction is the deep learning field that creates three-dimensional representations of scenes and objects from 2D images or text prompts — using…
3D Heterogeneous Packaging, Interposers, TSVs, Hybrid Bonding, and Cryogenic Quantum Co-Integration 1. Why packaging now limits quantum scaling A superconducting quantum processor…
3d human body pose estimation, 3d human body, human body pose, body pose estimation, 3d human, human body, body pose, pose estimation
3D Human Body Pose Estimation Introduction & Motivation 3D Human Body Pose Estimation addresses a central problem in vision process control and body-keypoint-skeleton-joint…
3d integrated circuit, 3d ic design implementation, through silicon via tsv, stacked die integration, hbm4 compute die integration, gpu hbm4 interposer
Advanced packaging is the set of techniques for assembling multiple dies into a single package so tightly that they behave almost like one chip — and for AI accelerators it has…
3d ic bonding alignment prediction with machine learning, 3d ic bonding alignment prediction machine learning, 3d ic, bonding alignment prediction, 3d-ic bonding alignment prediction
3D-IC Bonding Alignment Prediction with Machine Learning Introduction & Motivation 3D-IC Bonding Alignment Prediction with Machine Learning addresses a central problem in 3D-IC…
3d stacking tsv design, face to face bonding design, 3d ic thermal floorplanning, 3d ic power delivery design
Multi-Die 3D-IC Design Methodology is the comprehensive design flow for vertically stacking multiple silicon dies using through-silicon vias (TSVs) or face-to-face hybrid bonding…
advanced packaging
Advanced packaging is the set of technologies that connect, protect and cool silicon after it leaves the fab. It has moved from a cost-driven back-end afterthought to a primary…
monolithic 3d integration, sequential integration 3d, 3d stacking technology, heterogeneous integration 3d
3D Integration Methods are the architectural approaches that stack multiple device layers or dies vertically with high-density interconnections — achieving 10-100× higher…
monolithic 3d ic, layer transfer 3d, sequential 3d process flow, inter-layer via connection
Monolithic 3D Integration is sequential stacking of CMOS transistor layers on the same silicon wafer using low-temperature top-tier processing to avoid damaging lower…
vertical nand, v-nand, vnand, 3d flash memory, nand stacking, string stacking, gate all around nand, vertical channel nand
3D NAND flash is the memory architecture that escapes planar scaling limits by stacking hundreds of storage layers vertically — each layer is a word-line (gate) wrapping…
Flash Memory, array architecture, stacking
3D NAND flash is the memory architecture that escapes planar scaling limits by stacking hundreds of storage layers vertically — each layer is a word-line (gate) wrapping…
bs source contact, backside source line routing, bonded wafer source contact, backside metal source connection
Backside source contact is a third way into the same source-line plate that CSL contact fill and side-wall ONO removal already reach — and it exists only because bonded…
bit line sadp etch, self aligned double patterning nand, bl trench etch, mandrel spacer bit line pitch
Back-end bit-line etch is where the array's tightest pitch actually gets cut, and ordinary single-exposure lithography can't resolve it directly — which is why this step usually…
blc etch, bit line contact 3d nand, channel plug contact etch, bit line pitch sadp, tight pitch contact etch
Bit-line contact etch looks like the simplest contact in the whole 3D NAND flow — one depth, one landing surface — and it is still one of the hardest to etch cleanly, because that…
bsg cut etch, gsl cut etch, ground select line cut, source side select gate isolation, bottom select gate etch
BSG/GSL cut does for the source-side select gate exactly what TSG/SSL cut does for the drain side, splitting one continuous layer into independently switchable segments — except…
3d nand cell-to-cell leakage prediction, 3d nand cell-to-cell, nand cell-to-cell leakage, cell-to-cell leakage prediction, 3d nand, nand cell-to-cell, cell-to-cell leakage
3D NAND Cell-to-Cell Leakage Prediction with Machine Learning Introduction & Motivation 3D NAND Cell-to-Cell Leakage Prediction with Machine Learning addresses a central problem…
memory hole etch, channel hole aspect ratio, lower deck upper deck etch, inter deck plug etch, cryogenic channel hole etch, ch bottom punch
Channel hole etch is the step that actually makes 3D NAND possible, and it is the single hardest etch in the entire flow: a hole cut at an aspect ratio of 50 to 80-to-1 or more…
3d nand channel hole etch depth prediction machine learning, 3d nand, channel hole etch, 3d cd nand rf sem, 3d nand channel hole etch depth prediction, 3d nand channel
3D NAND Channel Hole Etch Depth Prediction with Machine Learning Introduction & Motivation 3D NAND Channel Hole Etch Depth Prediction with Machine Learning addresses a central…
channel poly recess, core oxide recess macaroni, drain poly etch back, channel hole drain plug sequence
Channel poly recess is the middle depth in a three-step sequence that carves room for the drain plug at the very top of a finished channel hole, cutting the conducting poly back…
3d nand charge trap efficiency prediction, 3d nand charge, nand charge trap, charge trap efficiency, trap efficiency prediction, 3d nand, nand charge, charge trap, trap efficiency
3D NAND Charge Trap Efficiency Prediction with Machine Learning Introduction & Motivation 3D NAND Charge Trap Efficiency Prediction with Machine Learning addresses a central…
csl void free fill, bottom up trench fill 3d nand, csl barrier seed layer, source line contact cmp overburden
Slit-bottom source-line contact fill is the step that actually closes the trench the slit module spent several etches preparing, and its hardest problem is not etch chemistry…
csl etch, slit spacer etch, common source line contact fill, csl contact 3d nand, source line plate etch
Common source line, or CSL, etch is the step that finally seals the slit trench for good — after that same opening has already carried the gate-replacement wet etch and…
ctn cut etch, trap layer separation etch, split cell two bits per hole etch, charge trap isolation etch, word line trap segment cut
Charge-trap nitride cut, or CTN cut, is a thin lateral etch that slices the charge-trap layer itself between adjacent word lines — a step most 3D NAND generations never needed…
drain poly etchback, channel hole plug cavity etch, drain plug recess depth, bit line contact landing surface
Drain poly etch-back is the deepest of the three recess cuts that finish the top of a channel hole, and it is the only one of the three with a direct electrical consumer waiting…
3d nand etch list, channel hole etch, staircase etch, gate line slit etch, replacement gate etch, wordline contact etch, v-nand etch, bics etch, xtacking etch
3D NAND replaces the one flat etch step of a planar chip with close to forty named etch applications, and almost all of them exist to solve one problem: getting a feature…
onon film stack, silicon nitride silicon dioxide stack, 3d nand deposition, pecvd nand stack, charge trap film stack, opop floating gate stack
The 3D NAND film stack is the foundation every later etch and fill step in the flow depends on: 200 to 300-plus alternating pairs of silicon dioxide and silicon nitride (ONON)…
nand string architecture, charge trap flash memory, 3d nand layer count, nand vertical channel
3D NAND flash is the memory architecture that escapes planar scaling limits by stacking hundreds of storage layers vertically — each layer is a word-line (gate) wrapping…
vertical channel NAND, charge trap flash memory, NAND string hole etch, multi-tier 3D NAND
3D NAND flash is the memory architecture that escapes planar scaling limits by stacking hundreds of storage layers vertically — each layer is a word-line (gate) wrapping…
peri gate spacer, source drain extension offset, anisotropic gate spacer, hv lv spacer width
Gate spacer etch is the step that decides exactly how close a source/drain implant can get to a peripheral transistor's channel, and it does that job the same way slit-spacer etch…
joint etch 3d nand, sac poly recess, lower deck upper deck alignment, channel hole deck seam etch, multi deck channel hole
Inter-deck plug, or joint etch, is the step that exists purely to let a channel hole be cut in two separate passes and still come out looking like one continuous hole — a seam…
word line deck bonding, cba cell array bonding, nand cell density increase, xtacking 3d nand
3D NAND String Architecture Beyond 200 Layers is a vertical stacking technology enabling unprecedented cell densities through 200+ controllable word line layers, mechanical…
peri ct etch, peri mc contact, peripheral logic deep via, periphery oxide fill contact
Peripheral deep contact, or Peri CT (sometimes Peri MC), reaches peripheral logic the same way TAC reaches the periphery underneath the array — a single deep via through a lot…
peri gate etch, poly gate etch dual oxide, hv lv gate oxide etch, gate oxide thickness selectivity
Peripheral gate etch cuts the HV and LV poly gates that make the periphery's two different transistor types work, and it has to do it as a single pass over a surface that is…
peri sti etch, shallow trench isolation 3d nand, hv lv transistor isolation, sti recess peripheral logic
Peripheral STI etch is the very first etch in the entire 3D NAND flow, and it looks nothing like any of the array-side etches that follow it — because it runs before the array…
sin pull back etch, word line metal recess, tungsten etch back 3d nand, molybdenum word line etch, csl contact fill, gate replacement module
Replacement gate is the step where 3D NAND actually becomes a gate-all-around transistor array, and it runs entirely through the slit trench that was just cut: every sacrificial…
slit bottom open etch, source line plate exposure etch, gls bottom punch, slit punch selectivity etch
Slit bottom punch is a short, separate etch run right after the main slit cut, and it exists because stopping a deep trench etch exactly on a thin film is a different, harder…