sac ox strip

# Sac Ox Strip

A sacrificial oxide strip removes a temporary oxide and prepares the intended next surface.

## Follow the transitions

Each box marks a manufacturing purpose, not an executable recipe. Some integrations combine steps or move strip and clean operations. Endpoint, where used, must be qualified against feature clearing and underlayer loss.

## Integration context

HF-based wet removal is common for suitable oxide/surface combinations, but the process also attacks other exposed susceptible oxides. This is not a universal way to remove resist, metals or every residue. Screen oxide may be stripped after its screening role; it is not inherently identical to every sacrificial oxide.

## What to verify

Confirm target clearing, protected oxide budget and post-strip surface condition.

Define the input surface and the acceptance criterion at each transition. A qualified transition must account for pattern density, wafer position and incoming-film variation; a nominal clearing time on one monitor does not establish the full operating window.

## Related terminology

sac ox strip, sacrificial oxide strip, SACOX strip. Short abbreviations are local process vocabulary and can have other meanings; use the full module name when searching.

## Source and scope

[Thermal oxide growth and deposited films](https://www.nanofab.ualberta.ca/capabilities/thin-film-deposition/). The diagram is an original teaching schematic. Layer choices and process families describe an example rather than a universal manufacturing recipe.