Metal1

# Metal1 / M1, M2 and Vias

M1 and M2 name wiring levels; they do not identify the metal chemistry.

## Use the technology layer map

A numbered level identifies an integration location. Its material, electrical role and neighboring dielectric must be read from the actual cross-section and process design kit.

## Integration context

A via connects adjacent wiring levels. In a common convention V1 connects M1 and M2, while a contact connects a device region to the first local wiring. The exact naming convention belongs to the process design kit. Some technologies include local interconnect below M1.

## What to verify

Read the layer map before assigning material, vertical order or an etch module.

Before selecting removal conditions, identify all exposed neighboring materials and the amount of loss each can tolerate. Verify the result using the measurements appropriate to the structure, then check that the surface is suitable for the next deposition, contact or clean step.

## Related terminology

Metal1, M1, MET1, M2, metal interconnect levels. Short abbreviations are local process vocabulary and can have other meanings; use the full module name when searching.

## Source and scope

[Aluminum etch and corrosion control](https://www.nanofab.ualberta.ca/avoiding-corrosion-when-dry-etching-aluminum/). The diagram is an original teaching schematic. Layer choices and process families describe an example rather than a universal manufacturing recipe.