met1 etch film

# MET1 Etch Film

MET1 Etch Film describes the target and protected films in this removal module.

## Identify the target film

Name the material intended for removal separately from the mask and the protected landing. Measure incoming thickness and surface state; film names alone do not specify etch behavior.

## Integration context

The illustrated subtractive aluminum module removes exposed AlCu while retaining masked lines. TiN can serve as an upper antireflective cap or a lower barrier; Ti and TiN layers are not interchangeable. A copper damascene flow instead patterns dielectric and fills metal.

## What to verify

Inspect linewidth, fences, alloy residues, barrier clearing and post-etch corrosion.

Before selecting removal conditions, identify all exposed neighboring materials and the amount of loss each can tolerate. Verify the result using the measurements appropriate to the structure, then check that the surface is suitable for the next deposition, contact or clean step.

## Related terminology

met1 etch film. Short abbreviations are local process vocabulary and can have other meanings; use the full module name when searching.

## Source and scope

[Aluminum etch and corrosion control](https://www.nanofab.ualberta.ca/avoiding-corrosion-when-dry-etching-aluminum/). The diagram is an original teaching schematic. Layer choices and process families describe an example rather than a universal manufacturing recipe.