0-8-micron-process

A 0.8-micron process belongs to the early submicron manufacturing generations. The nominal dimension is 800 nanometers. It identifies a process generation rather than the size of an entire transistor or chip. Contacts, metal pitches, isolation regions, and channel dimensions have different rules, so a cross-section should not label every feature as 0.8 micrometers.

The first Pentium provides a dated commercial example. Intel lists its March 1993 Pentium processors at 60 and 66 MHz with a 0.8-micron manufacturing process and 3.1 million transistors. These specifications identify that launch implementation; later processors sold under the Pentium name used smaller processes. Brand history and process history therefore need separate columns.

0.8-micron process Conceptual comparison; not a manufacturing specification or scale drawing Dimension 0.8 µm = 800 nm A process-generation label Commercial anchor Pentium: March 1993 60 / 66 MHz 3.1 million transistors Integration choice Logic or BiCMOS options Different devices and rules The same nominal node can support different device platforms and product generations.

The manufacturing platform matters as much as the nominal dimension. A logic process supplies transistor models, layout rules, contacts, and wiring options. A BiCMOS variant also includes bipolar devices. TSMC reported offering a 0.8-micrometer BiCMOS process in 1996, illustrating why two products carrying the same dimension can have different device choices and target applications.

The transition to smaller dimensions was gradual across product portfolios. TSMC’s 1995 report describes a declining share of 0.8-micron output as its smaller processes expanded. That is evidence of a manufacturing mix changing over time, not an instantaneous retirement of the older node. Established products can continue on an older process while new designs move forward.

A useful comparison starts with the actual circuit and its constraints. For a historical chip, identify the revision, supply requirements, die area, cache organization, and manufacturing date before attributing a speed change to lithography alone. An 800-nanometer label is valuable context, but it cannot independently predict cost, power, yield, or the instructions completed in one clock cycle.

Sources and further reading. [Intel historical processor reference](https://www.intel.com/pressroom/kits/quickreffam.htm); [TSMC 1995 annual report](https://investor.tsmc.com/sites/ir/annual-report/1995/annual1995.pdf); [TSMC 1997 process development report](https://investor.tsmc.com/static/annualReports/1997/business3.html).

Read 0.8-micron process as an early submicron manufacturing platform whose meaning depends on the specific process and chip revision.

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